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电絮凝-Electrochemistry Behind Electrocoagulation Usi

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  • 2019-03-25 11:34:24

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电絮凝-Electrochemistry Behind Electrocoagulation Using IronElectrodedoi:10.1149/1.27903972007,Volume6,Issue9,Pages1-15.ECSTrans.Parga,EricPetersonandCGarciaHectorA.MorenoCasillas,DavidL.Cocke,JewelA.Gomes,PaulMorkovsky,JoseR.ElectrodesElectrochemistryBehindElectrocoagulationUsingIronserviceEmailalertingclickhereboxatthetoprightcornerofthearticleorReceivefreeemailalertswhennewarticlescitethisarticle-signupinthehttp://ecst.ecsdl.org/subscriptionsgoto:ECSTransactionsTosubscribeto©2007ECS-TheElectrochemicalSocietywww.esltbd.orgaddress.RedistributionsubjecttoECSlicenseorcopyright;see60.191.17.246Downloadedon2013-02-20toIPElectrochemistrybehindElectrocoagulationusingIronElectrodesH.A.MorenoC.a,D.L.Cockea,J.A.G.Gomesa,P.Morkovskyb,J.R.Pargac,E.PetersonaandC.GarciadaGillChairofChemistryandChem.Eng.LamarUniversity,Beaumont,Texas77710,USAbKasparElectroplatingCorporation,Shiner,Texas77984,USAcDepartmentofMetallurgyandMaterialsScience,InstitutoTecnológicodeSaltillo,Saltillo,Coahuila25280,MéxicodChem

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